Easier Application and Removal: Designed for effortless application and removal, saving you time and effort during installation. Its intuitive design ensures a hassle-free experience for beginners.

Ultra Thermal Conductivity: Experience unprecedented thermal conductivity, ensuring fast and efficient heat dissipation. Our product is designed with cutting-edge technology to keep your devices cool, even in the most intense conditions.

Ultra-Durable & Non-Hardening: Built to last, our thermal interface is ultra-durable and maintains its effectiveness over time. Unlike conventional options, it does not cure or harden, ensuring consistent performance without degradation, even after extended use.

Non-electrical conductive: eliminates the risk of short circuits or electrical damage. Provides superior thermal management without compromising the integrity of electronic devices.

Technical specifications:

Density: 2.8 +/- 0.2g. cm³

Dimensions: 40x40x0.2mm (AMD version)

Dimensions: 40x30x0.2mm (Intel version)

Operating temperature range: -50 to 125°C

Phase transition temperature: 45°C

Thermal conductivity: 8.5 W/mk

Volume resistivity: 1.0x10.00